Transactions of The Japan Institute of Electronics Packaging
ISSN:
1883-3365
Country:
Japan
ES-FAC
ES-FAC C
Eurascience Journal Classification System
📄 Articles published in this journal
- Lower Inductance of POL Double-layer Facing Structure Power Module 2026
- Development of a Pre-Plating Cleaner with High Rinsability and Wettability for TGV Glass 2026
- Etching Process Analysis of Galvanic Corrosion Inhibition Etching Solution Using Quartz Crystal Microbalance Method 2026
- Reducing Electrical Resistivity of Copper-CNT Composite Film for High-Ampacity Back End of Line and Interconnection 2026
- Power Cycling Test Using Positive and Negative Gate-Voltage Switching Circuit for SiC-MOSFET Power Module 2025
- Low-temperature Cooking Using Dielectric Heating at 50 Hz AC Voltage and Pasteurization Effect 2025
- Design and Feasibility of Modular Design for the Electro-Optical Waveguide for Customization and Fabrication Improvement 2025
- Message from the Editor 2025
- Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys 2025
- Silver Paste Transferability during Imprinting Process 2025